Vol. 2 No. 3 (2025)

Articles

• Smart Sensors Embedded Systems for Environmental Monitoring System Integration

  Aung Kyaw Min, Nandar Hlaing Thandar, Zaw Thiha Htun (Author)

  1-11

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• Challenges and Solutions in Low-Power ASIC Design for Edge Computing Applications

  Ahmed Khan (Author)

  12-22

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• Performance Evaluation of CNTFET-Based 6T SRAM Cell for Next-Generation VLSI Circuits

  Rozman Zakariaa, Mohd Mustafa Al Bakri Abdullah (Author)

  23-30

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  • XML

• Design and Implementation of a Reconfigurable ASIC Architecture for Low-Power Secure Communication in IoT Devices

  Ata Assaf , Zakaria Hamimi (Author)

  31-37

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• Energy-Efficient 3D-Stacked CMOS–Memristor Hybrid Architecture for High-Density Non-Volatile Storage in Edge Computing Systems

  Ivan Petrovich Volkov, Eleazu Ogbonnaya (Author)

  38-46

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• AI-Integrated System-on-Chip (SoC) Architectures for High-Performance Edge Computing: Design Trends and Optimization Challenges

  Noel Unciano, Jeon Sungho (Author)

  47-55

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• A Scalable Parallel Processing Architecture for Real-Time and Energy-Efficient Biomedical Signal Analysis in Edge-Enabled Health Monitoring Systems

  Martin Kigarura, L. Rshour (Author)

  56-62

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• Reliability Analysis and Hardware Fault Injection for Safety-Critical Embedded Applications

  El Manaa Barhoumia, Hardley Caddwine (Author)

  63-72

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• Thermal-Aware System-on-Chip (SoC) Design for Real-Time Edge AI in Smart Healthcare Devices

  Ahmad Miladh, Lee Wei (Author)

  73-78

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• Hybrid CMOS-Photonic VLSI Interconnects for Ultra-High Bandwidth and Energy-Proportional Chiplet Communication in 2.5D/3D Systems

  H. Fratlin, Sulyukova (Author)

  79-88

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• 3D IC Integration with Through-Silicon Vias for High-Density Computing Applications: Design and Thermal Considerations

  Q. Hugh Li, Muralidharan J (Author)

  89-96

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