H. Fratlin, K.P. Sikalu. Hybrid CMOS-Photonic VLSI Interconnects for Ultra-High Bandwidth and Energy-Proportional Chiplet Communication in 2.5D/3D Systems. Journal of Integrated VLSI, Embedded and Computing Technologies [Internet]. 2025 Oct. 16 [cited 2025 Dec. 5];2(3):79-88. Available from: https://ecejournals.in/index.php/JIVCT/article/view/272