Kagaba J. Bosco, S. M Pavalam, L.J. Mpamije. “Thermal-Aware 3D TSV-Enabled NoC Topologies for High-Throughput SoC Accelerators”. Journal of Integrated VLSI, Embedded and Computing Technologies , vol. 3, no. 2, Feb. 2026, pp. 14-24, https://ecejournals.in/index.php/JIVCT/article/view/508.