Kagaba J. Bosco, S. M Pavalam, L.J. Mpamije (2026) “Thermal-Aware 3D TSV-Enabled NoC Topologies for High-Throughput SoC Accelerators”, Journal of Integrated VLSI, Embedded and Computing Technologies, 3(2), pp. 14–24. Available at: https://ecejournals.in/index.php/JIVCT/article/view/508 (Accessed: 5 March 2026).