KAGABA J. BOSCO, S. M PAVALAM, L.J. MPAMIJE. Thermal-Aware 3D TSV-Enabled NoC Topologies for High-Throughput SoC Accelerators. Journal of Integrated VLSI, Embedded and Computing Technologies , [S. l.], v. 3, n. 2, p. 14–24, 2026. Disponível em: https://ecejournals.in/index.php/JIVCT/article/view/508.. Acesso em: 5 mar. 2026.