Co-Simulation of RFIC Performance Using HSPICE and CST for Aerospace Communication Link

Abstract

The evolutionary progress of aerospace communication resources requires the fabrication of high performance Radio Frequency Integrated Circuits (RFICs) that are capable of exhibiting high levels of both performance and reliability even in extreme environmental conditions, such as wide temperature variations, and radiation exposure, and also a high-frequency spectral requirement base. Conventional medicine uses circuit-based design methods, which are limited in capturing complex electromagnetic (EM) and layout-dependant parasitic effects, which make a critical impact on the performance of RFIC devices in real environments. The paper achieves this by formulation of a very well developed and strong co-simulation model that closely integrates full-wave electromagnetic circuit analysis using CST Microwave Studio and transistor-level circuit analysis using HSPICE. The methodology suggested can offer comprehensive modeling and optimization of the active and passive elements of the circuit, including circuit inductors, transmission lines, bonds, packaging, and so on. Performance factors like S parameters, voltage gain, NF, PAE, linearity and EM radiation performance are measured at Ku- and at Ka-band frequencies which are essential in the satellite-ground and inter-satellite communication links in aerospace applications. Additionally, the algorithm supports layout parasitic extraction (LPE), thermal-aware simulation, and radiation-hardened design design to achieve high precision when subjected to operational stresses most likely to be found in aerospace missions. S-parameter models of EM structures that are important in the circuit functioning are formed through the application of CST to its corresponding regions and the resulting model is directly inserted into a HSPICE simulation, which in turn, forms a feedback loop between physical effects on layout and circuit behavior. The co-simulation solution has demonstrated that it aligns well with the actual performance in addition to enabling the optimization cycle in design to be faster due to the window that is opened by removing the separation between EM design and electrical validation. Degradation in thermal robustness and performance at elevated total ionising dose (TID) are also discussed in order to illustrate resiliency. This co-simulation platform is an acceptable accuracy and scalable approach which offers a solution to RFIC designers interested in aerospace-grade transceivers, as well as to the next-generation modules of high frequency communication with improved reliability, smaller size, and reduced power.