Antenna-in-Package (AiP) Integration Strategies for High-Frequency RFICs in 5G/6G Edge Devices: Design Challenges, Performance Trade-offs, and Future Opportunities

Abstract

Within the context of super-fast development of 5G and perceived use of 6G wireless networks, the rate at which small, high-frequency and power efficient Radio Frequency Integrated Circuits (RFICs) that can drive edge intelligence grows fast. An attractive candidate solution is known as the Antenna-in-Package (AiP) technology, which is the concept of integrating both RF transceiver and antenna groups in the same, miniaturized component to reduce parasitic losses and provide a better performance at millimeter-wave (mmWave) and sub-THz frequencies. This paper seeks to explore the state-of-the-art AiP-based solutions to the high-frequency RFICs in the 5G/6G edge devices. The overall approach synthesizing the tools of literature review,comparative analysis, and the electromagnetic simulation considerations is used to determine the significant design bottlenecks. The most important of these difficulties are electromagnetic interference, heat risen outflow, interconnect dispenses, and constraints in substances material. Antenna gain versus beam-steering fidelity graph and form factor versus cost graph are performed. Other technologies discussed in the review include advanced packaging concepts, which include fan-out wafer-level packaging (FOWLP), system-in-package (SiP) and 3D heterogeneous integration. The paper finds a conclusion by pointing out some new research challenges such as reconfigurable AiPs, AI-enabled co-design processes, conformal flexible packages, and sub-THz antenna arrays to be used beyond 6G. The results herein offer a great basis of future research and implementation of next-generation wireless edge systems with scalable, high-performance AiP architectures to the industry.