F. Mohd Zaki, and T Shimada , trans. “Thermal-Aware Floorplanning and Optimization Framework for High-Performance Heterogeneous SoC Architectures in Edge-AI and Embedded Systems”. Journal of Integrated VLSI, Embedded and Computing Technologies 3, no. 1 (January 23, 2023): 38–46. Accessed September 16, 2025. https://ecejournals.in/index.php/JIVCT/article/view/279.