H. Fratlin, and Sulyukova , translators. “Hybrid CMOS-Photonic VLSI Interconnects for Ultra-High Bandwidth and Energy-Proportional Chiplet Communication in 2.5D 3D Systems”. Journal of Integrated VLSI, Embedded and Computing Technologies , vol. 2, no. 3, Aug. 2025, pp. 79-88, https://doi.org/10.31838/JIVCT/02.03.10.