[1]
F. Mohd Zaki and T Shimada , Trans., “Thermal-Aware Floorplanning and Optimization Framework for High-Performance Heterogeneous SoC Architectures in Edge-AI and Embedded Systems”, Journal of Integrated VLSI, Embedded and Computing Technologies, vol. 3, no. 1, pp. 38–46, Jan. 2023, doi: 10.31838/JIVCT/03.01.06.