Thermal-Aware Floorplanning and Optimization Framework for High-Performance Heterogeneous SoC Architectures in Edge-AI and Embedded Systems. Journal of Integrated VLSI, Embedded and Computing Technologies , [S. l.], v. 3, n. 1, p. 38–46, 2023. DOI: 10.31838/JIVCT/03.01.06. Disponível em: https://ecejournals.in/index.php/JIVCT/article/view/279.. Acesso em: 16 sep. 2025.