Q. HUGH LI; MURALIDHARAN J. 3D IC Integration with Through-Silicon Vias for High-Density Computing Applications: Design and Thermal Considerations. Journal of Integrated VLSI, Embedded and Computing Technologies , [S. l.], v. 2, n. 3, p. 89–96, 2025. DOI: 10.31838/JIVCT/02.03.11. Disponível em: https://ecejournals.in/index.php/JIVCT/article/view/273.. Acesso em: 5 dec. 2025.