H. Fratlin, & K.P. Sikalu. (2025). Hybrid CMOS-Photonic VLSI Interconnects for Ultra-High Bandwidth and Energy-Proportional Chiplet Communication in 2.5D/3D Systems. Journal of Integrated VLSI, Embedded and Computing Technologies , 2(3), 79-88. https://doi.org/10.31838/JIVCT/02.03.10